AUTO BONDING MACHINE


High capacity with all automatic operation system of SYMKOS Auto Bonding machine

Multiple Types

High Performance

Automate system

Leading Dispenser Technique

SYMKOS

AUTO BONDING MACHINE

Main Feature

√High capacity by

+ All machine operation is automatic

+ Bonding TOP Side together at 2 station or TOP/BOTTOM independently

+ Use 10 Bonding Head together

+ Reduce loss time of glue in put by use Big Tank to keep glue

√Easy JOB change : Change Model by reloading Programming in HMI , Time setting is short

√Designed for Easy control, Easy maintenance and stable running

Machine Structure

Auto Transfer conveyor part

+ Auto Transfer PCBA into each station of Bonding

2) Motion X/Y/Z Part for TOP Side

+ Auto Move Bonding Head base on Position Setting

3) 2 Bonding Station and 2 rotary Part for Bonding Head

+ 1 Station have 5 Head to bonding 1 time for 5 position

And it will be set Enable bonding Position by setting based on each model

+ Bond Header can change degree by rotary part

4) Bonding Tank – 2 Set for separating TOP Side

+ One time can loading Big volume of bonding into Tank

5) Support place: Fixing PCBA when bonding

6) Control Unit

+ Easy Job change and setting machine parameter by HMI touch screen

+ Control panel was designed clearly and run stably

Specs

+ Size(mm): L1200 x W800 x H1650


+ Weight: 200 kg


+ Power: AC220V, 1.5KW


+ PCBA Size(mm): Max L300 x W200 x T50


+ Machine Capacity: 3,5 ~ 4K / Hour  Capacity for 20 hour: 70~80K products


SYMKOS PARTNER - TAEHA - INOVATE DISPENSING TECHNOLOGY

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